| Image | Product | Manufacturer | Description | History Price | Availability | Contact Finish - Mating | Contact Finish - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Post | Contact Material - Mating | Contact Material - Post | Features | Housing Material | Mounting Type | Number of Positions or Pins (Grid) | Operating Temperature | Part Status | Pitch - Mating | Pitch - Post | Termination | Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| TDU03DTOD | Sullins Connector Solutions | CONN SOCKET TRANSIST 3POS GOLD |
| 400 | Gold | Gold | 30.0µin (0.76µm) | 30.0µin (0.76µm) | Beryllium Copper | Beryllium Copper | Board Guide, Flange | Polyphenylene Sulfide (PPS) | Through Hole | 3 (Rectangular) | -55°C ~ 175°C | Active | - | - | Solder | Transistor | |
| 40-526-10 | Aries Electronics, Inc. | CONN IC DIP SOCKET ZIF 40POS TIN |
| 148 | Tin | Tin | 10.0µin (0.25µm) | 10.0µin (0.25µm) | Beryllium Copper | Beryllium Copper | Closed Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 40 (2 x 20) | -55°C ~ 105°C | Active | 0.100" (2.54mm) | 0.100" (2.54mm) | Solder | DIP, ZIF (ZIP) | |
| 28-6554-10 | Aries Electronics, Inc. | CONN IC DIP SOCKET ZIF 28POS TIN |
| 125 | Tin | Tin | 200.0µin (5.08µm) | 200.0µin (5.08µm) | Beryllium Copper | Beryllium Copper | Closed Frame | Polyphenylene Sulfide (PPS), Glass Filled | Through Hole | 28 (2 x 14) | - | Active | 0.100" (2.54mm) | 0.100" (2.54mm) | Solder | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | |
| 40-6554-10 | Aries Electronics, Inc. | CONN IC DIP SOCKET ZIF 40POS TIN |
| 217 | Tin | Tin | 200.0µin (5.08µm) | 200.0µin (5.08µm) | Beryllium Copper | Beryllium Copper | Closed Frame | Polyphenylene Sulfide (PPS), Glass Filled | Through Hole | 40 (2 x 20) | - | Active | 0.100" (2.54mm) | 0.100" (2.54mm) | Solder | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | |
| 48-6554-10 | Aries Electronics, Inc. | CONN IC DIP SOCKET ZIF 48POS TIN |
| 300 | Tin | Tin | 200.0µin (5.08µm) | 200.0µin (5.08µm) | Beryllium Copper | Beryllium Copper | Closed Frame | Polyphenylene Sulfide (PPS), Glass Filled | Through Hole | 48 (2 x 24) | - | Active | 0.100" (2.54mm) | 0.100" (2.54mm) | Solder | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | |
| 28-6554-11 | Aries Electronics, Inc. | CONN IC DIP SOCKET ZIF 28POS GLD |
| 765 | Gold | Gold | - | - | Beryllium Copper | Beryllium Copper | Closed Frame | Polyphenylene Sulfide (PPS), Glass Filled | Through Hole | 28 (2 x 14) | - | Active | 0.100" (2.54mm) | 0.100" (2.54mm) | Solder | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | |
| 32-6554-11 | Aries Electronics, Inc. | CONN IC DIP SOCKET ZIF 32POS GLD |
| 135 | Gold | Gold | - | - | Beryllium Copper | Beryllium Copper | Closed Frame | Polyphenylene Sulfide (PPS), Glass Filled | Through Hole | 32 (2 x 16) | - | Active | 0.100" (2.54mm) | 0.100" (2.54mm) | Solder | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | |
| 8058-1G19 | TE Connectivity AMP Connectors | CONN TRANSIST TO-5 8POS GOLD |
| 217 | Gold | Gold | - | - | Beryllium Copper | Brass | - | Polytetrafluoroethylene (PTFE) | Panel Mount | 8 (Round) | -55°C ~ 125°C | Active | - | - | Solder Cup | Transistor, TO-5 | |
| A 08-LC-TT | ASSMANN WSW Components | CONN IC DIP SOCKET 8POS TIN |
| 97,779 | Tin | Tin | - | - | Phosphor Bronze | Phosphor Bronze | Open Frame | Polybutylene Terephthalate (PBT) | Through Hole | 8 (2 x 4) | -55°C ~ 85°C | Active | 0.100" (2.54mm) | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
| 224-1286-00-0602J | 3M | CONN IC DIP SOCKET ZIF 24POS GLD |
| 157 | Gold | Gold | 30.0µin (0.76µm) | 30.0µin (0.76µm) | Beryllium Copper | Beryllium Copper | Closed Frame | Polysulfone (PSU), Glass Filled | Connector | 24 (2 x 12) | -55°C ~ 125°C | Active | 0.100" (2.54mm) | 0.100" (2.54mm) | Press-Fit | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | |
| 1-2199298-2 | TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS TIN |
| 36,926 | Tin | Tin | 60.0µin (1.52µm) | - | Phosphor Bronze | Brass, Copper | Open Frame | Polybutylene Terephthalate (PBT), Thermoplastic, Glass Filled | Through Hole | 8 (2 x 4) | -40°C ~ 105°C | Active | 0.100" (2.54mm) | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
| 40-6554-11 | Aries Electronics, Inc. | CONN IC DIP SOCKET ZIF 40POS GLD |
| 118 | Gold | Gold | - | - | Beryllium Copper | Beryllium Copper | Closed Frame | Polyphenylene Sulfide (PPS), Glass Filled | Through Hole | 40 (2 x 20) | - | Active | 0.100" (2.54mm) | 0.100" (2.54mm) | Solder | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | |
| A 14-LC-TT | ASSMANN WSW Components | CONN IC DIP SOCKET 14POS TIN |
| 161,127 | Tin | Tin | - | - | Phosphor Bronze | Phosphor Bronze | Open Frame | Polybutylene Terephthalate (PBT) | Through Hole | 14 (2 x 7) | -55°C ~ 85°C | Active | 0.100" (2.54mm) | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
| 1-2324271-2 | TE Connectivity AMP Connectors | LEFT SEGMEN LGA4189-4 SOCKET-P4 |
| 5,124 | Gold | Gold | 30.0µin (0.76µm) | 30.0µin (0.76µm) | Copper Alloy | Copper Alloy | Open Frame | Thermoplastic | Surface Mount | 2092 | -25°C ~ 100°C | Active | 0.039" (1.00mm) | 0.034" (0.86mm) | Solder | LGA 4189 | |
| 245-08-1-03 | CnC Tech | CONN IC DIP SOCKET 8POS TIN |
| 2,238 | Tin | Tin | 60.0µin (1.52µm) | 60.0µin (1.52µm) | Phosphor Bronze | Phosphor Bronze | Open Frame | Polybutylene Terephthalate (PBT), Glass Filled | Through Hole, Kinked Pin | 8 (2 x 4) | -40°C ~ 105°C | Active | 0.100" (2.54mm) | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
| 232-1287-00-0602J | 3M | CONN IC DIP SOCKET ZIF 32POS GLD |
| 127 | Gold | Gold | 30.0µin (0.76µm) | 30.0µin (0.76µm) | Beryllium Copper | Beryllium Copper | Closed Frame | Polysulfone (PSU), Glass Filled | Connector | 32 (2 x 16) | -55°C ~ 125°C | Active | 0.100" (2.54mm) | 0.100" (2.54mm) | Press-Fit | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | |
| 243-14-1-03 | CnC Tech | CONN IC DIP SOCKET 14POS TIN |
| 1,359 | Tin | Tin | 60.0µin (1.52µm) | 60.0µin (1.52µm) | Phosphor Bronze | Phosphor Bronze | Open Frame | Polybutylene Terephthalate (PBT), Glass Filled | Through Hole | 14 (2 x 7) | -40°C ~ 105°C | Active | 0.100" (2.54mm) | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
| 24-6554-16 | Aries Electronics, Inc. | CONN IC DIP SOCKET ZIF 24POS |
| 140 | Nickel Boron | Nickel Boron | 50.0µin (1.27µm) | 50.0µin (1.27µm) | Beryllium Copper | Beryllium Copper | Closed Frame | Polyphenylene Sulfide (PPS), Glass Filled | Through Hole | 24 (2 x 12) | - | Active | 0.100" (2.54mm) | 0.100" (2.54mm) | Solder | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | |
| 243-08-1-03 | CnC Tech | CONN IC DIP SOCKET 8POS TIN |
| 24,110 | Tin | Tin | 60.0µin (1.52µm) | 60.0µin (1.52µm) | Phosphor Bronze | Phosphor Bronze | Open Frame | Polybutylene Terephthalate (PBT), Glass Filled | Through Hole | 8 (2 x 4) | -40°C ~ 105°C | Active | 0.100" (2.54mm) | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
| 232-5205-01 | 3M | CONN SOCKET QFN 32POS GOLD |
| 57 | Gold | Gold | - | - | Beryllium Copper | Beryllium Copper | Closed Frame | Polyethersulfone (PES) | Through Hole | 32 (4 x 8) | - | Active | - | - | Solder | QFN | |
| 243-16-1-03 | CnC Tech | CONN IC DIP SOCKET 16POS TIN |
| 10,489 | Tin | Tin | 60.0µin (1.52µm) | 60.0µin (1.52µm) | Phosphor Bronze | Phosphor Bronze | Open Frame | Polybutylene Terephthalate (PBT), Glass Filled | Through Hole | 16 (2 x 8) | -40°C ~ 105°C | Active | 0.100" (2.54mm) | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
| 240-5205-01 | 3M | CONN SOCKET QFN 40POS GOLD |
| 117 | Gold | Gold | - | - | Beryllium Copper | Beryllium Copper | Closed Frame | Polyethersulfone (PES) | Through Hole | 40 (4 x 10) | - | Active | - | - | Solder | QFN | |
| 245-16-1-03 | CnC Tech | CONN IC DIP SOCKET 16POS TIN |
| 1,228 | Tin | Tin | 60.0µin (1.52µm) | 60.0µin (1.52µm) | Phosphor Bronze | Phosphor Bronze | Open Frame | Polybutylene Terephthalate (PBT), Glass Filled | Through Hole, Kinked Pin | 16 (2 x 8) | -40°C ~ 105°C | Active | 0.100" (2.54mm) | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing | |
| 248-5205-01 | 3M | CONN SOCKET QFN 48POS GOLD |
| 33 | Gold | Gold | - | - | Beryllium Copper | Beryllium Copper | Closed Frame | Polyethersulfone (PES) | Through Hole | 48 (4 x 12) | - | Active | 0.020" (0.50mm) | - | Solder | QFN | |
| ED281DT | On-Shore Technology, Inc. | CONN IC DIP SOCKET 28POS TIN |
| 20,375 | Tin | Tin | 60.0µin (1.52µm) | 60.0µin (1.52µm) | Phosphor Bronze | Phosphor Bronze | Open Frame | Polybutylene Terephthalate (PBT), Glass Filled | Through Hole | 28 (2 x 14) | -55°C ~ 110°C | Active | 0.100" (2.54mm) | 0.100" (2.54mm) | Solder | DIP, 0.3" (7.62mm) Row Spacing |
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