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Image Product Manufacturer Description History Price Availability Contact Finish - MatingContact Finish - PostContact Finish Thickness - MatingContact Finish Thickness - PostContact Material - MatingContact Material - PostFeaturesHousing MaterialMounting TypeNumber of Positions or Pins (Grid)Operating TemperaturePart StatusPitch - MatingPitch - PostTerminationType
TDU03DTOD Sullins Connector Solutions
CONN SOCKET TRANSIST 3POS GOLD
$13.800000
400
GoldGold30.0µin (0.76µm)30.0µin (0.76µm)Beryllium CopperBeryllium CopperBoard Guide, FlangePolyphenylene Sulfide (PPS)Through Hole3 (Rectangular)-55°C ~ 175°CActive--SolderTransistor
40-526-10 Aries Electronics, Inc.
CONN IC DIP SOCKET ZIF 40POS TIN
$15.180000
148
TinTin10.0µin (0.25µm)10.0µin (0.25µm)Beryllium CopperBeryllium CopperClosed FramePolyamide (PA46), Nylon 4/6, Glass FilledThrough Hole40 (2 x 20)-55°C ~ 105°CActive0.100" (2.54mm)0.100" (2.54mm)SolderDIP, ZIF (ZIP)
28-6554-10 Aries Electronics, Inc.
CONN IC DIP SOCKET ZIF 28POS TIN
$15.220000
125
TinTin200.0µin (5.08µm)200.0µin (5.08µm)Beryllium CopperBeryllium CopperClosed FramePolyphenylene Sulfide (PPS), Glass FilledThrough Hole28 (2 x 14)-Active0.100" (2.54mm)0.100" (2.54mm)SolderDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
40-6554-10 Aries Electronics, Inc.
CONN IC DIP SOCKET ZIF 40POS TIN
$19.320000
217
TinTin200.0µin (5.08µm)200.0µin (5.08µm)Beryllium CopperBeryllium CopperClosed FramePolyphenylene Sulfide (PPS), Glass FilledThrough Hole40 (2 x 20)-Active0.100" (2.54mm)0.100" (2.54mm)SolderDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
48-6554-10 Aries Electronics, Inc.
CONN IC DIP SOCKET ZIF 48POS TIN
$19.990000
300
TinTin200.0µin (5.08µm)200.0µin (5.08µm)Beryllium CopperBeryllium CopperClosed FramePolyphenylene Sulfide (PPS), Glass FilledThrough Hole48 (2 x 24)-Active0.100" (2.54mm)0.100" (2.54mm)SolderDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
28-6554-11 Aries Electronics, Inc.
CONN IC DIP SOCKET ZIF 28POS GLD
$21.080000
765
GoldGold--Beryllium CopperBeryllium CopperClosed FramePolyphenylene Sulfide (PPS), Glass FilledThrough Hole28 (2 x 14)-Active0.100" (2.54mm)0.100" (2.54mm)SolderDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
32-6554-11 Aries Electronics, Inc.
CONN IC DIP SOCKET ZIF 32POS GLD
$23.360000
135
GoldGold--Beryllium CopperBeryllium CopperClosed FramePolyphenylene Sulfide (PPS), Glass FilledThrough Hole32 (2 x 16)-Active0.100" (2.54mm)0.100" (2.54mm)SolderDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
8058-1G19 TE Connectivity AMP Connectors
CONN TRANSIST TO-5 8POS GOLD
$25.790000
217
GoldGold--Beryllium CopperBrass-Polytetrafluoroethylene (PTFE)Panel Mount8 (Round)-55°C ~ 125°CActive--Solder CupTransistor, TO-5
A 08-LC-TT ASSMANN WSW Components
CONN IC DIP SOCKET 8POS TIN
$0.190000
97,779
TinTin--Phosphor BronzePhosphor BronzeOpen FramePolybutylene Terephthalate (PBT)Through Hole8 (2 x 4)-55°C ~ 85°CActive0.100" (2.54mm)0.100" (2.54mm)SolderDIP, 0.3" (7.62mm) Row Spacing
224-1286-00-0602J 3M
CONN IC DIP SOCKET ZIF 24POS GLD
$26.460000
157
GoldGold30.0µin (0.76µm)30.0µin (0.76µm)Beryllium CopperBeryllium CopperClosed FramePolysulfone (PSU), Glass FilledConnector24 (2 x 12)-55°C ~ 125°CActive0.100" (2.54mm)0.100" (2.54mm)Press-FitDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
1-2199298-2 TE Connectivity AMP Connectors
CONN IC DIP SOCKET 8POS TIN
$0.200000
36,926
TinTin60.0µin (1.52µm)-Phosphor BronzeBrass, CopperOpen FramePolybutylene Terephthalate (PBT), Thermoplastic, Glass FilledThrough Hole8 (2 x 4)-40°C ~ 105°CActive0.100" (2.54mm)0.100" (2.54mm)SolderDIP, 0.3" (7.62mm) Row Spacing
40-6554-11 Aries Electronics, Inc.
CONN IC DIP SOCKET ZIF 40POS GLD
$27.860000
118
GoldGold--Beryllium CopperBeryllium CopperClosed FramePolyphenylene Sulfide (PPS), Glass FilledThrough Hole40 (2 x 20)-Active0.100" (2.54mm)0.100" (2.54mm)SolderDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
A 14-LC-TT ASSMANN WSW Components
CONN IC DIP SOCKET 14POS TIN
$0.230000
161,127
TinTin--Phosphor BronzePhosphor BronzeOpen FramePolybutylene Terephthalate (PBT)Through Hole14 (2 x 7)-55°C ~ 85°CActive0.100" (2.54mm)0.100" (2.54mm)SolderDIP, 0.3" (7.62mm) Row Spacing
1-2324271-2 TE Connectivity AMP Connectors
LEFT SEGMEN LGA4189-4 SOCKET-P4
$29.220000
5,124
GoldGold30.0µin (0.76µm)30.0µin (0.76µm)Copper AlloyCopper AlloyOpen FrameThermoplasticSurface Mount2092-25°C ~ 100°CActive0.039" (1.00mm)0.034" (0.86mm)SolderLGA 4189
245-08-1-03 CnC Tech
CONN IC DIP SOCKET 8POS TIN
$0.240000
2,238
TinTin60.0µin (1.52µm)60.0µin (1.52µm)Phosphor BronzePhosphor BronzeOpen FramePolybutylene Terephthalate (PBT), Glass FilledThrough Hole, Kinked Pin8 (2 x 4)-40°C ~ 105°CActive0.100" (2.54mm)0.100" (2.54mm)SolderDIP, 0.3" (7.62mm) Row Spacing
232-1287-00-0602J 3M
CONN IC DIP SOCKET ZIF 32POS GLD
$34.650000
127
GoldGold30.0µin (0.76µm)30.0µin (0.76µm)Beryllium CopperBeryllium CopperClosed FramePolysulfone (PSU), Glass FilledConnector32 (2 x 16)-55°C ~ 125°CActive0.100" (2.54mm)0.100" (2.54mm)Press-FitDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
243-14-1-03 CnC Tech
CONN IC DIP SOCKET 14POS TIN
$0.240000
1,359
TinTin60.0µin (1.52µm)60.0µin (1.52µm)Phosphor BronzePhosphor BronzeOpen FramePolybutylene Terephthalate (PBT), Glass FilledThrough Hole14 (2 x 7)-40°C ~ 105°CActive0.100" (2.54mm)0.100" (2.54mm)SolderDIP, 0.3" (7.62mm) Row Spacing
24-6554-16 Aries Electronics, Inc.
CONN IC DIP SOCKET ZIF 24POS
$48.690000
140
Nickel BoronNickel Boron50.0µin (1.27µm)50.0µin (1.27µm)Beryllium CopperBeryllium CopperClosed FramePolyphenylene Sulfide (PPS), Glass FilledThrough Hole24 (2 x 12)-Active0.100" (2.54mm)0.100" (2.54mm)SolderDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
243-08-1-03 CnC Tech
CONN IC DIP SOCKET 8POS TIN
$0.300000
24,110
TinTin60.0µin (1.52µm)60.0µin (1.52µm)Phosphor BronzePhosphor BronzeOpen FramePolybutylene Terephthalate (PBT), Glass FilledThrough Hole8 (2 x 4)-40°C ~ 105°CActive0.100" (2.54mm)0.100" (2.54mm)SolderDIP, 0.3" (7.62mm) Row Spacing
232-5205-01 3M
CONN SOCKET QFN 32POS GOLD
$101.520000
57
GoldGold--Beryllium CopperBeryllium CopperClosed FramePolyethersulfone (PES)Through Hole32 (4 x 8)-Active--SolderQFN
243-16-1-03 CnC Tech
CONN IC DIP SOCKET 16POS TIN
$0.340000
10,489
TinTin60.0µin (1.52µm)60.0µin (1.52µm)Phosphor BronzePhosphor BronzeOpen FramePolybutylene Terephthalate (PBT), Glass FilledThrough Hole16 (2 x 8)-40°C ~ 105°CActive0.100" (2.54mm)0.100" (2.54mm)SolderDIP, 0.3" (7.62mm) Row Spacing
240-5205-01 3M
CONN SOCKET QFN 40POS GOLD
$107.660000
117
GoldGold--Beryllium CopperBeryllium CopperClosed FramePolyethersulfone (PES)Through Hole40 (4 x 10)-Active--SolderQFN
245-16-1-03 CnC Tech
CONN IC DIP SOCKET 16POS TIN
$0.340000
1,228
TinTin60.0µin (1.52µm)60.0µin (1.52µm)Phosphor BronzePhosphor BronzeOpen FramePolybutylene Terephthalate (PBT), Glass FilledThrough Hole, Kinked Pin16 (2 x 8)-40°C ~ 105°CActive0.100" (2.54mm)0.100" (2.54mm)SolderDIP, 0.3" (7.62mm) Row Spacing
248-5205-01 3M
CONN SOCKET QFN 48POS GOLD
$115.450000
33
GoldGold--Beryllium CopperBeryllium CopperClosed FramePolyethersulfone (PES)Through Hole48 (4 x 12)-Active0.020" (0.50mm)-SolderQFN
ED281DT On-Shore Technology, Inc.
CONN IC DIP SOCKET 28POS TIN
$0.370000
20,375
TinTin60.0µin (1.52µm)60.0µin (1.52µm)Phosphor BronzePhosphor BronzeOpen FramePolybutylene Terephthalate (PBT), Glass FilledThrough Hole28 (2 x 14)-55°C ~ 110°CActive0.100" (2.54mm)0.100" (2.54mm)SolderDIP, 0.3" (7.62mm) Row Spacing